ISPEC to Drive India’s Semiconductor, Packaging and Systems Research Ambitions for sustainable Design led Manufacturing

Mohali, 01 March, 2024: The India Semiconductor and Packaging Ecosystem Conference (ISPEC) was inaugurated today (29th Feb) by Hon’ble Sh. Rajeev Chandrasekhar, Minister of State for Electronics and IT and Skill Development and Entrepreneurship and will continue till March 2nd, 2024, at Mohali, India, supported by ISM, SCL, IESA, IEEE Packaging Society, and ISSE. As India embarks on a transformative

Read more